X-ray diffraction and thermal wave analysis of primary recrystallization in electrodeposited copper layers at room temperature

✍ Scribed by S. Surnev; I. Tomov

• Publisher: Springer
• Year: 1992
• Tongue: English
• Weight: 666 KB
• Volume: 22
• Category: Article
• ISSN: 0021-891X
• DOI: 10.1007/bf01077550