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Effect of mould release agent on epoxy resin surface degradation

✍ Scribed by Hepburn, D.M.; Kemp, I.J.; Shields, A.J.; Cooper, J.M.

Book ID
114457030
Publisher
The Institution of Electrical Engineers
Year
1999
Tongue
English
Weight
466 KB
Volume
146
Category
Article
ISSN
1350-2344

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πŸ“œ SIMILAR VOLUMES

Effect of kinetic and thermal parameters
Effect of kinetic and thermal parameters on the process of cure of epoxy resin in a cylindrical mould
✍ M. Chater; J.M. Vergnaud πŸ“‚ Article πŸ“… 1987 πŸ› Elsevier Science 🌐 English βš– 506 KB

Various parameters were found to be important in the cure of epoxy resin, those concerned with the kinetics of the heat evolved from the reaction (such as the order, rate constant and activation energy) and those related to the thermal properties of the resin, such as thermal diffusivity and heat ca