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Effect of nanosilica on the kinetics of cure reaction and thermal degradation of epoxy resin

โœ Scribed by M. Ghaemy; M. Bazzar; H. Mighani


Publisher
Institute of Chemistry Chinese Academy of Sciences
Year
2010
Tongue
English
Weight
525 KB
Volume
29
Category
Article
ISSN
0256-7679

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The cure reactions of tetraglycidyl methylene diamine (TGMDA) epoxy cured with tetrasubstituted aromatic diamine on one hand and diglycidyl ether of bisphenol A and diglycicyl ether tetrabromobisphenol A epoxies cured with methylene bis (phenyl-4-cyanate) on the other hand are reported. Systematic F