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Effect of low-temperature annealing on the structure of Cu57Zr43glass

โœ Scribed by H. S. Chen; K. T. Aust; Y. Waseda

Publisher
Springer
Year
1983
Tongue
English
Weight
297 KB
Volume
2
Category
Article
ISSN
0261-8028

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Pure Cu film and Cu(Mg) films having 1-4.5 at.% Mg were sputter-deposited on glass substrates, and annealed in vacuum at varying temperatures up to 400 ยฐC. We investigated the effects of the Mg content and the annealing temperature on the resistivity and adhesion force of the Cu(Mg) film. We also di