Fracture properties of molding compound
✦ LIBER ✦
Effect of inorganic binders on the properties of thick film copper conductor : Toshio Ogawa et al., IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part A, 17, 4, 625 (December 1994)
- Book ID
- 103287321
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 111 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.
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