✦ LIBER ✦
Fracture properties of molding compound materials for IC plastic packaging : John Sauber, Lidia Lee, Shih Hsu and Trirat Hongsmatip. IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part A, 17, 4, 533 (December 1994)
- Book ID
- 103286661
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 114 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0026-2714
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