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Effect of Impurities on Interfacial Void Formation in Aluminum

✍ Scribed by Huang, Renchun; Hebert, Kurt R.; Gessmann, Thomas; Lynn, Kelvin G.

Book ID: 124081562
Publisher: The Electrochemical Society
Year: 2004
Tongue: English
Weight: 271 KB
Volume: 151
Category: Article
ISSN: 0013-4651
DOI: 10.1149/1.1666148

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