Effect of imidization temperature on the adhesion of polyimide on aluminum

✍ Scribed by Jyongsik Jang; Jeung Hoon Lee

• Publisher: John Wiley and Sons
• Year: 1996
• Tongue: English
• Weight: 995 KB
• Volume: 62
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/(sici)1097-4628(19961003)62:1<199::aid-app23>3.0.co;2-#

✦ Synopsis

Peel strength and lap shear strength between aluminum and polyimide were measured at diff'erent imidization temperatures. Polyimide was synthesized from 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4'-diaminophenylether (ODA). T h e interfacial adhesion between polyimide and aluminum shows a maximum value a t the imidization temperature of 320°C. T o relate the intefacial adhesion strength with chemical interaction between polyimide a n d aluminum, the Fourier transform infrared spectroscopy (FTIR) ATR technique was used. In addition, morphological studies on the peeled surfaces were also carried out.