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Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints

✍ Scribed by X. N. Du; J. D. Guo; J. K. Shang

Publisher: Springer US
Year: 2009
Tongue: English
Weight: 657 KB
Volume: 38
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-009-0917-x

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