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Effect of coupling agents on thermal, flow, and adhesion properties of epoxy/silica compounds for capillary underfill applications

✍ Scribed by Gun-Young Heo; Soo-Jin Park


Book ID
119352036
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
873 KB
Volume
230
Category
Article
ISSN
0032-5910

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