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Effect of Chemical Composition on Adhesion of Directly Electrodeposited Copper Film on TiN

✍ Scribed by Kim, Sunjung; Duquette, David J.

Book ID: 125543750
Publisher: The Electrochemical Society
Year: 2006
Tongue: English
Weight: 185 KB
Volume: 153
Category: Article
ISSN: 0013-4651
DOI: 10.1149/1.2189971

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