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Effects of current density on adhesion of copper electrodeposits to polyimide substrates

โœ Scribed by G.A. Prentice; K.S. Chen

Book ID
111529589
Publisher
Springer
Year
1998
Tongue
English
Weight
126 KB
Volume
28
Category
Article
ISSN
0021-891X

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๐Ÿ“œ SIMILAR VOLUMES

Effect of an interfacial layer on adhesi
Effect of an interfacial layer on adhesion strength deterioration between a copper thin film and polyimide substrates
โœ Satoru Iwamori; Takehiro Miyashita; Shin Fukuda; Shouhei Nozaki; Kazufuyu Sudoh; ๐Ÿ“‚ Article ๐Ÿ“… 1998 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 243 KB

Copper (Cu) was sputtered onto a polyetheretherketon (PEEK) film and onto three types of polyimide (PI) films; pyromellitic dianhydride-oxydianiline (PMDA-ODA), biphenyl dianhydride-para-phenylene diamine (BPDA-PDA) and biphenyl dianhydride-oxydianiline (BPDA-ODA). All films were pre-treated with ox