Effect of Cd2+ as a stabilizer in the electroless nickel plating system

✍ Scribed by Zongyuan Xiao; Wenjing Wang; Liyi Ye; Yong Sha; Song Tu

• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 808 KB
• Volume: 202
• Category: Article
• ISSN: 0257-8972
• DOI: 10.1016/j.surfcoat.2008.05.002

✦ Synopsis

Bath decomposition is a major problem in the electroless nickel (EN) plating system. Although the stabilization mechanism is far from being fully understood, bath stabilizers are normally added to extend the bath life in a viable EN plating solution. In this study, the effects of Cd 2+ as a stabilizer on the plating rate, bath stability, and phosphorus content, corrosion resistance and microstructure of the deposits were investigated. The deposited films were examined using a scanning electron microscope (SEM) equipped with energy dispersive X-ray (EDX) spectroscopy and the X-ray photo spectroscopy (XPS). The electronic tunneling mechanism was used to elucidate the effect of the Cd 2+ stabilizer on the plating system theoretically. The results calculated from theoretical method agreed well with the experimental data.