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Role of Cu2+ as an Additive in an Electroless Nickel—Phosphorus Plating System: A Stabilizer or a Codeposit?

✍ Scribed by Chun-Han Chen; Bing-Hung Chen; L. Hong


Publisher
John Wiley and Sons
Year
2006
Weight
12 KB
Volume
37
Category
Article
ISSN
0931-7597

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✦ Synopsis


Abstract

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