Effect of Alloying Interlayer on Interfacial Bond Strength of CuW/CuCr Integral Materials
โ Scribed by Xiaohong Yang; Juntao Zou; Shuhua Liang; Peng Xiao; Zhikang Fan
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 636 KB
- Volume
- 527
- Category
- Article
- ISSN
- 0921-5093
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
A single layer of CuCr alloy was sputter deposited on polyimide films instead of Cu/Cr double layers. The adhesion strengths of the metal/polyimide thin films were measured by the peel test. In order to study the effects of temperature and humidity on the adhesion strength, 85 ~ R.H. (T/H) treatment
The diffusion bonding of Mg and Al alloys with different interlayer compositions was investigated, where the interlayer was prepared through hot dipping technique in pure Zn, Zn-8Al and Zn-5Al baths, respectively. By means of microstructure characterization and strength measurement, it is found that