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Doubleside polishing—a technology mandatory for 300 mm wafer manufacturing

✍ Scribed by G Wenski; T Altmann; W Winkler; G Heier; G Hölker

No coin nor oath required. For personal study only.

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New challenges for 300 mm Si techno

✍ V. Dragoi; P. Lindner; M. Tischler; C. Schaefer 📂 Article 📅 2002 🏛 Elsevier Science 🌐 English ⚖ 281 KB

Doubleside polishing—a technology mandatory for 300&#xa0;mm wafer manufacturing