✦ LIBER ✦
New challenges for 300 mm Si technology: 3D interconnects at wafer scale by aligned wafer bonding
✍ Scribed by V. Dragoi; P. Lindner; M. Tischler; C. Schaefer
- Publisher
- Elsevier Science
- Year
- 2002
- Tongue
- English
- Weight
- 281 KB
- Volume
- 5
- Category
- Article
- ISSN
- 1369-8001
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