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Dislocation structure in coarse-grained copper after ion implantation

✍ Scribed by Yu.P. Sharkeev; N.V. Girsova; A.I. Ryabchikov; E.V. Kozlov; O.B. Perevalova; I.G. Brown; X.Y. Yao


Book ID
113288054
Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
972 KB
Volume
106
Category
Article
ISSN
0168-583X

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A gradient structure was produced in a pure copper plate by means of surface mechanical attrition treatment (SMAT). The microstructure of the surface layer was reduced to nanoscale and the grain size increased gradually along the depth of the treated sample. In situ transmission electron microscopy