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Dislocation processes during plastic deformation of Si and Ge in the range 0.50 to 0.95 of the melting temperature

✍ Scribed by Aseev, A. L. ;Golobokov, Yu. N. ;Stenin, S. I.


Publisher
John Wiley and Sons
Year
1975
Tongue
English
Weight
681 KB
Volume
28
Category
Article
ISSN
0031-8965

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The hot deformation behavior of electrolytic touch pitch (ETP) copper has been studied in the temperature range 300-950 β€’ C and strain rate range 0.001-100 s -1 using isothermal hot compression tests. Processing maps are developed at different plastic strains with a view to characterize the dynamics