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Direct bonding of Si wafer pairs with SiO2 and Si3N4 films with a fast linear annealing

✍ Scribed by Sang Hyun Lee; Ohsung Song; C.S. Yoon; C.K. Kim

Publisher: Elsevier Science
Year: 2002
Tongue: English
Weight: 177 KB
Volume: 5
Category: Article
ISSN: 1369-8001
DOI: 10.1016/s1369-8001(02)00059-8

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