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Diffusion bonding of silicon nitride to austenitic stainless steel with metallic interlayers

✍ Scribed by B. T. J. Stoop; G. den Ouden

Book ID
112821700
Publisher
The Minerals, Metals & Materials Society
Year
1995
Tongue
English
Weight
769 KB
Volume
26
Category
Article
ISSN
1073-5623

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Diffusion bonding of a Cu–Cr–Zr alloy to
Diffusion bonding of a Cu–Cr–Zr alloy to stainless steel and tungsten using nickel as an interlayer
✍ I.S. Batra; G.B. Kale; T.K. Saha; A.K. Ray; J. Derose; J. Krishnan πŸ“‚ Article πŸ“… 2004 πŸ› Elsevier Science 🌐 English βš– 180 KB

In the present work, diffusion bonding of Cu-1 wt.% Cr-0.1 wt.% Zr alloy to tungsten as well as to stainless steel 316 (SS) has been attempted using nickel as an interlayer. This could be achieved in a single step and the bonds were found to be metallurgically sound with the strength exceeding that