𝔖 Bobbio Scriptorium

✦ LIBER ✦

Differential pressure test: A quantitative stress test method for bonded beam-leaded devices : E. J. Boore and D. M. Sutter. Proc. 21st Electronic Components Conf. Washing D.C., U.S.A., 10–12 May (1971), p. 2

Publisher: Elsevier Science
Year: 1971
Tongue: English
Weight: 108 KB
Volume: 10
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(71)90014-x

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Testing integrated circuits with a laser

Testing integrated circuits with a laser beam : R. E. McMahon. Proc. 21st Electronic Components Conf., Washington D.C., U.S.A., 10–12 May (1971), p. 412

📂 Article 📅 1971 🏛 Elsevier Science 🌐 English ⚖ 109 KB

Beam-lead and wire thermocompression bon

Beam-lead and wire thermocompression bonding : F. L. Howland. Proc. 21st Electron. Compon. Conf., Washington D.C., U.S.A., 10–12 May (1971), p. 285

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 108 KB

Precision adjusted, beam-leaded, thin fi

Precision adjusted, beam-leaded, thin film resistors : M. Tierman and W. Wesolowski. Proc. 21st Electronic Components Conf., Washington D.C., U.S.A., 10–12 May (1971), p. 32

📂 Article 📅 1971 🏛 Elsevier Science 🌐 English ⚖ 110 KB

Magnetic handling of beam lead integrate

Magnetic handling of beam lead integrated circuits : H. E. Hughes and M. H. Wachs. Proc. 21st Electron. Compon. Conf., Washington D.C., U.S.A. 10–12 May (1971), p. 417

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 110 KB

Production method for aluminum beam lead

Production method for aluminum beam leads on ceramic substrates : R. E. McMahon, F. J. Bachner, R. A. Cohen, W. S. Franklin and J. D. Impey. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 96

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 107 KB