𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Dielectric monitoring of curing process for some epoxide-amine thermosets

✍ Scribed by M. Włodarska; G. Bąk; B. Mossety-Leszczak; H. Galina; T. Pakula


Book ID
116670411
Publisher
Elsevier Science
Year
2007
Tongue
English
Weight
258 KB
Volume
353
Category
Article
ISSN
0022-3093

No coin nor oath required. For personal study only.


📜 SIMILAR VOLUMES


Application of dielectric analysis for m
✍ Milan Sernek; Frederick A. Kamke 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 238 KB

Dielectric analysis (DEA) was conducted for continuous in-process monitoring of the curing of phenol formaldehyde (PF) adhesive. The influence of wood moisture content (MC) on the dielectric signal obtained in the PF adhesive bond was examined. The cure kinetics of the PF adhesive was evaluated at f