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Dielectric behavior of curing phenolic-formal resins

โœ Scribed by L. K. H. Van Beek


Publisher
John Wiley and Sons
Year
1964
Tongue
English
Weight
407 KB
Volume
8
Category
Article
ISSN
0021-8995

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Curing behavior and thermal property of
โœ Jungang Gao; Yanfang Liu ๐Ÿ“‚ Article ๐Ÿ“… 2000 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 196 KB ๐Ÿ‘ 2 views

The curing reaction of bisphenol-A epoxy resin (BPAER) with boron-containing phenol-formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER-BPFR was shown to follow autocatalytic kinet