Development of Nondestructive Pull Test Requirements for Gold Wires on Multilayer Thick-Film Hybrid Microcircuits

✍ Scribed by Blazek, R.

• Book ID: 117911492
• Publisher: IEEE
• Year: 1983
• Tongue: English
• Weight: 904 KB
• Volume: 6
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/tchmt.1983.1136220