Development of nondestructive pull test requirements for gold wires on multilayer thick-film hybrid microcircuits : Roy J. Blazek. IEEE Trans. Components Hybrids Mfg Technol.CHMT-6 (4), 503 (December 1983)

• Book ID: 103276161
• Publisher: Elsevier Science
• Year: 1984
• Tongue: English
• Weight: 127 KB
• Volume: 24
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(84)90175-6