๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Development of moulded pulp materials for the packaging of electronic equipment

โœ Scribed by Tsutomu Noguchi; Mayumi Miyashita; Jun'etsu Seto; Masaru Tan; Mitoshi Kawano

Publisher
John Wiley and Sons
Year
1997
Tongue
English
Weight
266 KB
Volume
10
Category
Article
ISSN
0894-3214

No coin nor oath required. For personal study only.

โœฆ Synopsis

A new shredded pulp-plastic microsphere composite with modified starch binder which is applicable to the packaging of electronic equipment has been developed. This composite with a 3 wt% microsphere content has almost the same compressive stress at 50% compressive strain as that of (poly)styrene foam, which has a specific gravity of 0.025. A moulded sample of the above composites can be released from a mould after 1.5 minutes of steam heating, the same cycle time as that of styrene foam.

๐Ÿ“œ SIMILAR VOLUMES

Development of methods for testing barri
Development of methods for testing barriers in food packaging materials
โœ Aurela, Birgit ;Tapanila, Tarja ;Osmonen, Riitta-Maija ;Sรถderhjelm, Lliva ๐Ÿ“‚ Article ๐Ÿ“… 1997 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 370 KB

## Abstract In some countries recycled materials are not allowed to come into contact with food without a protective layer such as plastic or virgin fiber. The purpose of this kind of barrier is to reduce migration of substances form beyond the barrier to the food. Two methods for studying a functi

Developments in plastics packaging for t
Developments in plastics packaging for the transport of dangerous goods
โœ Ton Schilperoord ๐Ÿ“‚ Article ๐Ÿ“… 1999 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 96 KB ๐Ÿ‘ 2 views

Several interesting developments in plastics packagings and intermediate bulk containers (IBCs) for the transport of dangerous goods are of importance. Signiยฎcant developments include the application of new materials and packaging concepts, the increasing re-use of packaging and the possibility of t