Development of intergranular thermal residual stresses in beryllium during cooling from processing temperatures

✍ Scribed by D.W. Brown; T.A. Sisneros; B. Clausen; S. Abeln; M.A.M. Bourke; B.G. Smith; M.L. Steinzig; C.N. Tomé; S.C. Vogel

• Book ID: 103998676
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 347 KB
• Volume: 57
• Category: Article
• ISSN: 1359-6454
• DOI: 10.1016/j.actamat.2008.09.044

✦ Synopsis

The intergranular thermal residual stresses in texture-free solid polycrystalline beryllium were determined by comparison of crystallographic lattice parameters in solid and powder samples measured by neutron diffraction during cooling from 800 °C. The internal stresses are not significantly different from zero >575 °C and increase nearly linearly <525 °C. At room temperature, the c axis of an average grain is under $200 MPa of compressive internal stress, and the a axis is under 100 MPa of tensile stress. For comparison, the stresses have also been calculated using an Eshelby-type polycrystalline model. The measurements and calculations agree very well when temperature dependence of elastic constants is accounted for, and no plastic relaxation is allowed in the model.