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Developing a neural network-based run-to-run process controller for chemical-mechanical planarization

โœ Scribed by Gou-Jen Wang; Cheng-Hsiong Yu


Publisher
Springer
Year
2006
Tongue
English
Weight
963 KB
Volume
28
Category
Article
ISSN
0268-3768

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Run-to-run control of a plasma etch process for 8 inch diameter silicon wafers at Digital Semiconductor is determined by maintenance of targeted values of post-etch metrology variables. The post-etch quality variables are extremely sensitive to variation in the etch chamber conditions due to fluctua