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Determination of yielding and debonding in Al–Cu thin films from residual stress measurements via diffraction

✍ Scribed by Shute, C.J.; Cohen, J.B.

Book ID: 115464230
Publisher: Cambridge University Press
Year: 1991
Tongue: English
Weight: 652 KB
Volume: 6
Category: Article
ISSN: 0884-2914
DOI: 10.1557/jmr.1991.0950

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