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Determination of Mechanical Properties of Copper at the Micron Scale

✍ Scribed by D. Kiener; C. Motz; T. Schöberl; M. Jenko; G. Dehm

Publisher
John Wiley and Sons
Year
2006
Tongue
English
Weight
469 KB
Volume
8
Category
Article
ISSN
1438-1656

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✦ Synopsis

Using a focused ion beam workstation, micron‐sized bending and compression samples were fabricated from a pure copper single crystal. The bending and compression experiments exhibited a strong size effect on the flow stress of copper, reaching values in the order of 1 GPa for the smallest test structures. Conventional strain gradient plasticity approaches are not capable of explaining this behaviour. The surface damage introduced by Ga^+^ ion implantation during focused ion beam preparation was investigated using Auger electron spectroscopy and its consequence on the mechanical response of the miniaturized test samples is addressed.

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