✦ LIBER ✦

Design for packageability-early consideration of packaging from a VLSI designer's viewpoint

✍ Scribed by Dehkordi, P.H.; Bouldin, D.W.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Internal thermal resistance of a multi-c

✍ Lee, Y.C.; Ghaffari, H.T.; Segelken, J.M. 📂 Article 📅 1989 🏛 IEEE 🌐 English ⚖ 730 KB

Characteristic Impedance Design Consider

✍ Temmyo, J.; Yoshikiyo, H. 📂 Article 📅 1985 🏛 IEEE 🌐 English ⚖ 467 KB

A study of shock characterization for pr

✍ S. W. Lye; M.Y Teo; S. C. Lew 📂 Article 📅 1995 🏛 Springer US 🌐 English ⚖ 923 KB

Design of a Simulation Package for Autom

✍ Susan K. Norman; Donald E. Scheck 📂 Article 📅 1986 🏛 Elsevier Science 🌐 English ⚖ 308 KB

A program package for solving problems o

✍ T. Yu. Gainutdinova 📂 Article 📅 2007 🏛 Allerton Press, Inc. 🌐 English ⚖ 211 KB

ADVIS: A Software Package for the Design

✍ Moldovan, D.I. 📂 Article 📅 1987 🏛 IEEE 🌐 English ⚖ 1004 KB