Design and testing of a kinematic package supporting a 32×32 array of GaAs MQW modulators flip-chip bonded to a CMOS chip

✍ Scribed by Ayliffe, M.H.; Rolston, D.R.; Chuah, A.E.L.; Bernier, E.; Michael, F.S.J.; Kabal, D.; Kirk, A.G.; Plant, D.V.

• Book ID: 115370241
• Publisher: Optical Society of America
• Year: 2001
• Tongue: English
• Weight: 625 KB
• Volume: 19
• Category: Article
• ISSN: 0733-8724
• DOI: 10.1109/50.956142