Large array of GaAs modulators and detectors flip-chip solder bonded to silicon CMOS using InGaP as the selective etch stop for GaAs substrate removal

✍ Scribed by J.M. Kuo; Y.C. Wang; K.W. Goossen; L.M.F. Chirovsky; S.P. Hui; B.T. Tseng; J. Walker; A.L. Lentine; R.E. Leibenguth; G. Livescu; W.Y. Jan; J.E. Cunningham; L.A. D'Asaro; A. Ron; D. Dahringer; D. Kossives; D.D. Bacon; R.L. Morrison; R.A. Novotny; D.B. Buchholz; W.E. Mayo

• Book ID: 108342450
• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 364 KB
• Volume: 175-176
• Category: Article
• ISSN: 0022-0248
• DOI: 10.1016/s0022-0248(96)01206-7