Design and performance of a system for VLSI packaging: thermal modeling and characterization : Zbigniew J. Staszak, John L. Prince, Bradly J. Cooke and David A. Shope. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 628 (1987)

• Publisher: Elsevier Science
• Year: 1989
• Tongue: English
• Weight: 140 KB
• Volume: 29
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(89)90441-1