In the fabrication of integrated circuits it is a common practice to measure the oxide thickness at many locations on a wafer and to summarize these measurements in terms of the average thickness and thickness uniformity. These summary measures, however, may not be as informative as certain features
Design and implementation of a process optimizer: a case study on monitoring molding operations
β Scribed by H.C.W. Lau; C.K.M. Lee; W.H. Ip; F.T.S. Chan; R.W.K. Leung
- Book ID
- 111060399
- Publisher
- John Wiley and Sons
- Year
- 2005
- Tongue
- English
- Weight
- 198 KB
- Volume
- 22
- Category
- Article
- ISSN
- 0266-4720
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When initiating a new design, designers usually begin with a database to look for historical design solution, past experience and available techniques through design documents. This database is a collection of labeled design documents under predefined categories, and covers the concerned aspects fro
## Abstract This study focuses on the physical property model parameters estimation in order to accurately simulate separation processes for a given set of components. The nonβrandom twoβliquid (NRTL) model was chosen and parameters were calculated using different methods: experimental data regress