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A case study on process monitoring for surface features

✍ Scribed by Winson Taam


Publisher
John Wiley and Sons
Year
1998
Tongue
English
Weight
218 KB
Volume
14
Category
Article
ISSN
0748-8017

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✦ Synopsis


In the fabrication of integrated circuits it is a common practice to measure the oxide thickness at many locations on a wafer and to summarize these measurements in terms of the average thickness and thickness uniformity. These summary measures, however, may not be as informative as certain features of the thickness surface in terms of the process objectives. Alternative surface features are considered and process monitoring techniques are illustrated using a sample of wafers. Β©1998 John Wiley & Sons, Ltd.


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