Process thinking has expanded in recent years mainly due to the need for improved quality of operations. As a result, there is a growing need for business modelling and analysis techniques that provide justification for understanding and analysis of the organizational environment with the aim of dev
A case study on process monitoring for surface features
β Scribed by Winson Taam
- Publisher
- John Wiley and Sons
- Year
- 1998
- Tongue
- English
- Weight
- 218 KB
- Volume
- 14
- Category
- Article
- ISSN
- 0748-8017
No coin nor oath required. For personal study only.
β¦ Synopsis
In the fabrication of integrated circuits it is a common practice to measure the oxide thickness at many locations on a wafer and to summarize these measurements in terms of the average thickness and thickness uniformity. These summary measures, however, may not be as informative as certain features of the thickness surface in terms of the process objectives. Alternative surface features are considered and process monitoring techniques are illustrated using a sample of wafers. Β©1998 John Wiley & Sons, Ltd.
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