The design, modeling, and optimization of a novel, thermally actuated CMOS-MEMS switch are presented in this article. This series capacitive MEMS switch solves the substrate loss and down-state capacitance degradation problems commonly plaguing MEMS switches. The switch uses finger structure for cap
β¦ LIBER β¦
Design and Development of a Package Using LCP for RF/Microwave MEMS Switches
β Scribed by Chen, M.J.; Pham, A.-V.H.; Evers, N.A.; Kapusta, C.; Iannotti, J.; Kornrumpf, W.; Maciel, J.J.; Karabudak, N.
- Book ID
- 114660691
- Publisher
- IEEE
- Year
- 2006
- Tongue
- English
- Weight
- 857 KB
- Volume
- 54
- Category
- Article
- ISSN
- 0018-9480
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