𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Derating of semiconductor fuselinks for use in high-frequency applications

✍ Scribed by Howe, A.F.; Jordan, CM.

Book ID
114446788
Publisher
The Institution of Electrical Engineers
Year
1982
Tongue
English
Weight
626 KB
Volume
129
Category
Article
ISSN
0143-7038

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Optimization of substrate thickness in G
Optimization of substrate thickness in GaAs MMICs for high-frequency applications: Using microstrip line
✍ Jay Prakash Thakur; A. K. Pandey; Ashutosh Kedar; K. K. Gupta; H. P. Vyas πŸ“‚ Article πŸ“… 2004 πŸ› John Wiley and Sons 🌐 English βš– 85 KB

## Abstract This paper presents optimization of GaAs substrate thickness for GaAs‐MMIC processes at high frequencies using a multidielectric microstrip line, that is fabricated using MMIC process. The spectral‐domain technique is used for the theoretical evaluation of the characteristic parameters

Modeling of chip resistors for high-freq
Modeling of chip resistors for high-frequency microwave applications with the use of the FD-TD method
✍ Y. C. Lau; M. S. Leong; P. S. Kooi πŸ“‚ Article πŸ“… 1997 πŸ› John Wiley and Sons 🌐 English βš– 109 KB πŸ‘ 2 views

The FD-TD method was used to model physical chip resistors with the use of the lumped-element concept. Instead of using the con¨entional planar resisti¨e elements approximation, we modeled the substrate on which the resisti¨e element is fabricated as well. Comparing our numerical results with experi