Deposition rate and morphology of electroless copper film from solutions containing 2,2′-dipyridyl

✍ Scribed by Masahiro Oita; Masao Matsuoka; Chiaki Iwakura

• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 516 KB
• Volume: 42
• Category: Article
• ISSN: 0013-4686
• DOI: 10.1016/s0013-4686(96)00367-2

✦ Synopsis

Crystal structure and surface morphology of electroless copper films deposited from solutions containing 2,2'-dipyridyl were investigated by X-ray diffraction and electron microscopic observations. The deposition rate of copper was remarkably affected by bath temperature and 2.2'-dipyridyl concentration. Although CuzO was codeposited in the copper film prepared at 30' C, pure metallic copper was obtained at 70-C regardless of dissolved 0:. The surface morphology of the copper deposit plated at 30 C exhibited a fine grain structure, while a coarse grain structure was observed for the copper deposit plated at 70 C. Changes in crystal structure and surface morphology of the copper films are discussed as a function of deposition rate.