Degradation mechanism of ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure

✍ Scribed by M. Yamashita; K. Suganuma

• Book ID: 107452797
• Publisher: Springer US
• Year: 2002
• Tongue: English
• Weight: 426 KB
• Volume: 31
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-002-0124-5