✦ LIBER ✦
Effect of the joining pressure on Ag-epoxy conductive adhesive/Sn interfaces exposed to heat
✍ Scribed by M. Yamashita; K. Suganuma
- Book ID
- 111553563
- Publisher
- Springer
- Year
- 2003
- Tongue
- English
- Weight
- 401 KB
- Volume
- 22
- Category
- Article
- ISSN
- 0261-8028
No coin nor oath required. For personal study only.