Damping capacity of nanotwinned copper
β Scribed by A.I. Ustinov; V.S. Skorodzievski; E.V. Fesiun
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 323 KB
- Volume
- 56
- Category
- Article
- ISSN
- 1359-6454
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Ultra-fine grained copper with a large amount of nano-scale twin boundaries has high mechanical strength and maintains normal electrical conductivity. The combination of these properties may lead to promising applications in future Si microelectronic technology, especially as interconnect material f
In this research parallel molecular dynamics (MD) simulations have been performed to study the deformation behavior of nanocrystalline copper samples with embedded nanotwins under approximately uniaxial tensile load. Simulation results reveal that twin boundaries (TBs) act as obstacles to dislocatio