Current applications of low pressure rf plasma to thin and thick film technologies: A Jacob, Abstract. (Proc 19th Nat Symp Am Vac Soc) J Vac Sci Technol, 10 (1), Jan/Feb. 1973, 264

• Publisher: Elsevier Science
• Year: 1973
• Tongue: English
• Weight: 170 KB
• Volume: 23
• Category: Article
• ISSN: 0042-207X
• DOI: 10.1016/0042-207x(73)92149-0