The curing reaction of bisphenol-A epoxy resin (BPAER) with boron-containing phenol-formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER-BPFR was shown to follow autocatalytic kinet
Curing kinetics of boron-containing phenol–formaldehyde resin formed from paraformaldehyde
✍ Scribed by Yanfang Liu; Jungang Gao
- Publisher
- John Wiley and Sons
- Year
- 2002
- Tongue
- English
- Weight
- 117 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0538-8066
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✦ Synopsis
Abstract
A boron‐containing phenol–formaldehyde resin (BPFR) was synthesized from boric acid, phenol, and paraformaldehyde. The curing reaction of BPFR was studied by Fourier‐transform infrared spectrometry and differential scanning calorimetry. According to the heat evolution behavior during the curing process, several influencing factors on isothermal curing reaction were evaluated. The results show that the isothermal kinetic reaction of BPFR follows autocatalytic kinetics mechanism, and kinetic parameters m, n, k~1~, and k~2~, were derived, respectively. In the latter reaction stage, the curing reaction becomes controlled mainly by diffusion. © 2002 Wiley Periodicals, Inc. Int J Chem Kinet 34: 638–644, 2002
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## Abstract Octa(aminophenyl) polyhedral oligomeric silsesquioxane (OAP‐POSS) and boron‐containing phenol‐formaldehyde resin (BPFR) were synthesized, respectively. The BPFR nanocomposites with different OAP‐POSS content (wt%) were prepared, and their properties were characterized. The results show