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Curing effect on the relaxation modulus and thermal expansion coefficient of rodlike polyimide films

✍ Scribed by Jou, Jwo Huei; Chung, Cheng Sheng

Book ID: 127277144
Publisher: American Chemical Society
Year: 1992
Tongue: English
Weight: 640 KB
Volume: 25
Category: Article
ISSN: 0024-9297
DOI: 10.1021/ma00048a027

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