Chemorheology and corresponding models for an epoxy-terminated poly-(phenylene ether ketone) (E-PEK) and 4,4 -diaminodiphenyl sulfone (DDS) system were investigated using a differential scanning calorimeter (DSC) and a cone-andplate rheometer. For this system, the reported four-parameter chemorheolo
Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone). IV. Cure cycle simulation
โ Scribed by Qiang Wang; Tianbai He; Ping Xia; Tianlu Chen; Baotong Huang
- Publisher
- John Wiley and Sons
- Year
- 1997
- Tongue
- English
- Weight
- 216 KB
- Volume
- 66
- Category
- Article
- ISSN
- 0021-8995
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โฆ Synopsis
Epoxy-terminated poly(phenylene ether ketone) (E-PEK) developed in this Institute is a candidate matrix resin for polymer composites as structural materials. Cure cycles for this reaction system were simulated according to the previously established processing model. It is found that for the E-PEK system, the curing process is best completed by a stepwise cure cycle comprising two isothermal processes at different temperatures, T 1 and T 2 . The cure cycles over a wide range of processing parameters simulated, based on the established processing model, indicate that the processing window is width-adjustable. Analysis of the mechanical properties of the composite sheets showed that the simulated cure cycles are acceptable and reliable.
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The curing reaction process of epoxy-terminated poly(phenylene ether ketone) (E-PEK) with 4,4-diaminodiphenyl sulfone (DDS) and hexahydrophthalic acid anhydride (Nadic) as curing agents was investigated using isothermal differential scanning calorimetry (IDSC) and nonisothermal differential scanning
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