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Cure kinetics of high performance epoxy resin systems

✍ Scribed by Jyong Sup Shim; Weon Lee; Jyongsik Jang


Publisher
Springer
Year
1991
Tongue
English
Weight
301 KB
Volume
25
Category
Article
ISSN
0170-0839

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The cure kinetics of four epoxy/amine systems including commercial RTM6 and F934 resins have been investigated under both isothermal and dynamic curing conditions. Differential Scanning Calorimetry (DSC) was the thermoanalytical technique used to determine the cure kinetics of these resin systems. T