Crystallization and failure behavior of Ta-Ni nanostructured/amorphous diffusion barriers for copper metallization

✍ Scribed by J. S. Fang; T. P. Hsu; G. S. Chen

• Book ID: 107453178
• Publisher: Springer US
• Year: 2004
• Tongue: English
• Weight: 405 KB
• Volume: 33
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-004-0120-z