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Critical dimension and real-time temperature control for warped wafers

✍ Scribed by Weng Khuen Ho; Arthur Tay; Jun Fu; Ming Chen; Yong Feng


Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
318 KB
Volume
18
Category
Article
ISSN
0959-1524

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## Abstract We describe a rapid digital system for X‐ray diffraction imaging and demonstrate its application to the real‐time identification of edge defects in a silicon wafer that had been subjected to rapid thermal annealing. The application of the system to the __in situ__ study of slip nucleati